Project

Clean Wafer Cut

Title: Clean Wafer Cut

Description: Both in microelectronics (Intel and others) and in photovoltaics (Meyer Burger and others), silicon wafers have to be cut to a target format. There are various processes, including mechanical sawing, "scribe and break" or separation by means of a local thermal shock (rapid sequence of laser heating and aerosol cooling, so-called "Thermal Laser Separation", "TLS"). TLS is the only process that is free of any material loss. However, crack control is not fully understood and not yet fully controlled, which is why other, abrasive processes are still mostly used in the microelectronics and photovoltaic industries. Our aim here is to understand the TLS process in more scientific detail and thereby significantly improve crack control. If successful, an ablation-free process will be available to the industries.

Duration: 01.04.2024 - 31.03.2027

Funding body: European Union & State of Saxony-Anhalt

Funding program: EFRE